金属化陶瓷–用于电子元件和线路的锡焊

Metalized Ceramics for Soldering of Electronic Elements and Circuits

Alumina ceramic substrate offers excellent high frequency characteristics and high temperature-withstanding, corrosion -resistant, non-deformation, electrical insulation, and vaccum tight. Ceramic surface after metalization can be connected to metals by brazing. Further more, after gold-plating or tin-plating, it can be mounted and soldered on PCB. It has been widely used in vacuum electronic components, conductor base, resistor base, I.C. substraste, etc.

 

	项目 Items 单位 Unit 用于锡焊 for Soldering 作业温度 Operation Temperature °C 200-400 抗拉强度 Pull-Withstanding MPa >=10 润湿性 wettability   >90% (for Tin/Rosin) 打线/点焊 Bonding/Welding (ø0.14mm  copper wire) >=150gf (no plated layer peel-off )